Hight Energy Tube
Powerful Penetration for Dense Objects Engineered with high-power output for imaging high-density subjects. It maintains stable and robust performance even in demanding environments like C-arms, CT scans, and heavy industrial NDT.
EV Battery
Inspection
An in-line inspection solution optimized for high-speed battery production. Utilizing CNT-based ultra-fast pulse control, it captures crystal-clear, blur-free images of moving battery cells, ensuring precise electrode alignment and maximizing production yield.
Key Specifications
110~160kV
High Speed Pulse
Motion Blur Free
In-line System
EV Battery
Semiconductor &
PCB Inspection
High-resolution inspection equipment featuring micro-focus technology. It validates circuit continuity in multi-layer PCBs, BGA soldering quality, and wire bonding within semiconductor packages with micrometer-level precision.
Key Specifications
130~160kV
Micro Focus
High Resolution
BGA / Wire Bonding
Static CT
Security Scanner
Next-generation security technology that eliminates rotating gantries. By arranging multiple CNT sources in a stationary ring and firing them sequentially, it offers superior durability without vibration and provides rapid, 360-degree volumetric analysis of baggage.
Key Specifications
140~180kV
Static Gantry
No Moving Parts
High Throughput
Airport Security
Industrial
3D CT
A Non-Destructive Testing (NDT) system designed for dense metal components. High-energy beams penetrate automotive parts and die-castings to perform precise 3D analysis of internal defects, such as voids and cracks, ensuring structural integrity.
Key Specifications
160~240kV
NDT Solution
3D Analysis
Void Detection
Hight Energy Tube
Powerful Penetration for Dense Objects Engineered with high-power output for imaging high-density subjects. It maintains stable and robust performance even in demanding environments like C-arms, CT scans, and heavy industrial NDT.
EV Battery
Inspection
An in-line inspection solution optimized for high-speed battery production. Utilizing CNT-based ultra-fast pulse control, it captures crystal-clear, blur-free images of moving battery cells, ensuring precise electrode alignment and maximizing production yield.
Key Specifications
110~160kV
High Speed Pulse
Motion Blur Free
In-line System
EV Battery
Semiconductor &
PCB Inspection
High-resolution inspection equipment featuring micro-focus technology. It validates circuit continuity in multi-layer PCBs, BGA soldering quality, and wire bonding within semiconductor packages with micrometer-level precision.
Key Specifications
130~160kV
Micro Focus
High Resolution
BGA / Wire Bonding
Static CT
Security Scanner
Next-generation security technology that eliminates rotating gantries. By arranging multiple CNT sources in a stationary ring and firing them sequentially, it offers superior durability without vibration and provides rapid, 360-degree volumetric analysis of baggage.
Key Specifications
140~180kV
Static Gantry
No Moving Parts
High Throughput
Airport Security
Industrial
3D CT
A Non-Destructive Testing (NDT) system designed for dense metal components. High-energy beams penetrate automotive parts and die-castings to perform precise 3D analysis of internal defects, such as voids and cracks, ensuring structural integrity.
Key Specifications
160~240kV
NDT Solution
3D Analysis
Void Detection
Hight Energy Tube
Powerful Penetration for Dense Objects Engineered with high-power output for imaging high-density subjects. It maintains stable and robust performance even in demanding environments like C-arms, CT scans, and heavy industrial NDT.
EV Battery
Inspection
An in-line inspection solution optimized for high-speed battery production. Utilizing CNT-based ultra-fast pulse control, it captures crystal-clear, blur-free images of moving battery cells, ensuring precise electrode alignment and maximizing production yield.
Key Specifications
110~160kV
High Speed Pulse
Motion Blur Free
In-line System
EV Battery
Semiconductor &
PCB Inspection
High-resolution inspection equipment featuring micro-focus technology. It validates circuit continuity in multi-layer PCBs, BGA soldering quality, and wire bonding within semiconductor packages with micrometer-level precision.
Key Specifications
130~160kV
Micro Focus
High Resolution
BGA / Wire Bonding
Static CT
Security Scanner
Next-generation security technology that eliminates rotating gantries. By arranging multiple CNT sources in a stationary ring and firing them sequentially, it offers superior durability without vibration and provides rapid, 360-degree volumetric analysis of baggage.
Key Specifications
140~180kV
Static Gantry
No Moving Parts
High Throughput
Airport Security
Industrial
3D CT
A Non-Destructive Testing (NDT) system designed for dense metal components. High-energy beams penetrate automotive parts and die-castings to perform precise 3D analysis of internal defects, such as voids and cracks, ensuring structural integrity.
Key Specifications
160~240kV
NDT Solution
3D Analysis
Void Detection