This product is X-ray detector device for dental diagnosis and examination based on large size system semiconductor packaging technology.
CMOS sensor which is essential component of detector is made uponSi wafer and attached with other substrates by soft epoxy use.
Wire bonding as low temperature bonding process links imaging chip between PCB substrate for electronic signal connection.
More than that, CSI attach uses clear bonding process(No bubbles) and it can make quite clean and clear imaging and can contribute to image quality improvement.
Lastly, multi-array structure of large size sensors is possible to manufacture.