Product
- Product
- X-ray Detector
X-ray Detector
System Semiconductor Packaging
- This product is X-ray detector device for dental diagnosis and examination based on large size system semiconductor packaging technology.
- CMOS sensor which is essential component of detector is made uponSi wafer and attached with other substrates by soft epoxy use.
- Wire bonding as low temperature bonding process links imaging chip between PCB substrate for electronic signal connection.
- More than that, CSI attach uses clear bonding process(No bubbles) and it can make quite clean and clear imaging and can contribute to image quality improvement.
- Lastly, multi-array structure of large size sensors is possible to manufacture.
| Item | X-ray Detector | |
|---|---|---|
| Model | Panorama | Cephalo |
| Size | 275 X 45 | 170 X 45 |
| CMOS(Wafer) | Si 0.75mmt | |
| Die Attach | Soft Epoxy | |
| Base Substrate | Al6061 | |
| Wire Bonding | Gold Wire(Low Temp) | |
| CsI Bonding | Clear Bonding (No Bubble) | |
| Use | Extra-Oral | |