Rustic organic interiors

In home nature

Wafer Chip Level Packaging

• Si Wager Structu • Vaccum Reflow

Technology

Hermetic Packaging

• 10-3 torr

• Solder Welding

• Vaccum Reflow

Mass Production

Vacuum Packaging

Technology

TOF Packaging

• 2W Laser Module

• Heat Emission

Technology

Infrared Packaging
(Micro Bolometer)

• Metal-Ceramic • Baffle Design

• Cold Shield Design • IR Window

Technology

CNT X-ray Tube
(X-ray Source)

• 10-8 torr • Ceramic Tube

Mass Production

Optical Design

• Infrared Lens • Visible Lens

Special Packaging

Vacuum Packaging

Wafer Chip Level Packaging

• Si Wager Structu • Vaccum Reflow

Technology

Hermetic Packaging

• 10-3 torr

• Solder Welding

• Vaccum Reflow

Mass Production

Vacuum Packaging

Technology

TOF Packaging

• 2W Laser Module

• Heat Emission

Technology

Infrared Packaging
(Micro Bolometer)

• Metal-Ceramic • Baffle Design

• Cold Shield Design • IR Window

Technology

CNT X-ray Tube
(X-ray Source)

• 10-8 torr • Ceramic Tube

Mass Production

Optical Design

• Infrared Lens • Visible Lens

Special Packaging

Vacuum Packaging

Wafer Chip Level Packaging

• Si Wager Structu

• Vaccum Reflow

Technology

Hermetic Packaging

/ Vacuum Packaging

• 10-3 torr

• Solder Welding

• Vaccum Reflow

Mass Production

Technology

TOF Packaging

• 2W Laser Module

• Heat Emission

Technology

Infrared Packaging
(Micro Bolometer)

• Metal-Ceramic

• Baffle Design

• Cold Shield Design

• IR Window

Technology

CNT X-ray Tube
(X-ray Source)

• 10-8 torr • Ceramic Tube

Mass Production

Optical Design

• Infrared Lens • Visible Lens

Special Packaging

Vacuum Packaging

Contact us

Contact us